Under the motto “Rethink Nonwovens”, Henkel will present breakthrough solutions to enhance the sustainability and efficiency in Nonwovens manufacturing at INDEX 2023, held from April 18 to 21 at Palexpo, Geneva, Switzerland. At stand 2255, Henkel will showcase Technomelt DM ECO, a new sustainability-focused adhesives grade for the Nonwovens market. For high performance, high efficiency bonding applications, Henkel will present its state-of-the-art Easyflow® hot melt adhesive solution, which employs an auto-feed system for safe and efficient delivery to set new standards in process performance. At INDEX, visitors can also learn more about Smart Adult Care, an innovative solution from Henkel Qhesive Solutions that combines Nonwovens with printable electronics to revolutionize adult incontinence management.
On March 20, 2023, Henkel celebrates the 175th birthday of its founder Fritz Henkel. His values, his pioneering spirit and his sense of responsibility continue to shape the company culture to this day.
prejsť na článokHenkel has launched a new Application Center in Vellore, India. The center will serve as a beacon of the company´s latest sustainable adhesive solutions for the sports industry, especially for footwear automation. With the opening Henkel aims to further d
prejsť na článokHenkel has officially opened its “J-beauty innovation hub” in Tokyo. The hub for the Hair Professional business will leverage the long-standing expertise of Schwarzkopf and Shiseido Professional in hair color innovation and trends as well as premium hair
prejsť na článokAs the world seeks solutions to environmental challenges, the furniture industry must meet changing consumer expectations and increasingly ambitious regulatory demands. The products of today and tomorrow must not only delight aesthetically but also provid
prejsť na článokAs integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches to die thermal control and electrical performance are required. Henkel today announced the availability of a die attach adhesive that provi
prejsť na článok