The benefits of via-in-pad designs are well documented. From reduction of inductance to increased density, via-in-pad has become an essential tool for designers when navigating the routing challenges of fine pitch array packages that have become mainstays in today’s BOMs but there are trade-offs that must be considered. The basic concept is elegant. The via-in-pad [] The post PCB design tips: Via-in-pad appeared first on NCAB Group.